Log in. Hi [[ session. Smart materials are materials whose properties or shape respond dynamically to stimuli in their environment. For example, piezoelectric materials experience strain under an applied electric field, while magnetostrictive materials deform in the presence of a magnetic field. In this live webinar, you will learn how to model MEMS sensors and actuators based on smart materials for a wide range of applications, including vibration and active shape control as well as structural health monitoring and energy harvesting. Recorded Apr 27 60 mins.
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Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. It illustrates how fluid flow can deform solid structures and how to solve for the flow in a continuously deforming geometry.
Read More. This model shows how to analyze a simple, cantilever based, piezoelectric energy harvester. A sinusoidal acceleration is applied to the energy harvester and the output power is evaluated as a function of frequency, load impedance and acceleration magnitude.
This example illustrates the ability to couple thermal, electrical, and structural analysis in one model. This particular application moves a beam by passing a current through it; the current generates heat, and the temperature increase leads to displacement through thermal expansion. Piezoresistive pressure sensors were some of the first MEMS devices to be commercialized. Compared to capacitive pressure sensors, they are simpler to integrate with electronics, their response is more linear and they are inherently shielded from RF noise.
They do, however, usually A capacitive pressure sensor is simulated. This model shows how to simulate the response of the pressure sensor to an applied pressure, and also how to analyze the effects of packing induced stresses on the sensor performance. The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at degrees C. The temperature of the plate is reduced to degrees C and thermal stresses are induced due to the difference This example shows how to set up a piezoelectric transducer problem following the work of Y.
Kagawa and T. The composite piezoelectric ultrasonic transducer has a cylindrical geometry that consists of a piezoceramic layer, two aluminum layers, and two adhesive layers. Bulk Acoustic Wave BAW resonators can be used as narrow band filters in radio-frequency applications.
The chief advantage compared with traditional ceramic electromagnetic resonators is that BAW resonators, thanks to the acoustic wavelength being much smaller than the electromagnetic The elastic cantilever beam is one of the elementary structures used in MEMS designs. This model shows the bending of a cantilever beam under an applied electrostatic load. The model solves the deformation of the beam under an applied voltage.
A surface acoustic wave SAW is an acoustic wave propagating along the surface of a solid material. Its amplitude decays rapidly, often exponentially, through the depth of the material. SAWs are utilized in many kinds of electronic components, including filters, oscillators, and You can fix this by pressing 'F12' on your keyboard, Selecting 'Document Mode' and choosing 'standards' or the latest version listed if standards is not an option.
North America. Log Out Log In Contact. OK Learn More. Quick Search. MEMS Module x. Sort by: Popularity Popularity Newest. Piezoelectric Energy Harvester This model shows how to analyze a simple, cantilever based, piezoelectric energy harvester. Microresistor Beam This example illustrates the ability to couple thermal, electrical, and structural analysis in one model.
Capacitive Pressure Sensor A capacitive pressure sensor is simulated. Thermal Stresses in a Layered Plate The thermal stress in a layered plate is studied in this example.
Composite Piezoelectric Transducer This example shows how to set up a piezoelectric transducer problem following the work of Y. Log Out.
Simulating MEMS and Smart Materials with COMSOL Multiphysics®
When and Where
The Electromechanics, Boundary Elements interface combines the functionality of the Solid Mechanics and Electrostatics, Boundary Elements interfaces to model the deformation of electrostatically actuated structures. The coupling is a boundary load on a structure caused by the Maxwell stress at the interface of the solid domains and nonsolid voids, where the electric field is computed using the boundary element method. The backward coupling to the Electrostatics interface is due to the deformations of the boundaries. Physics interfaces based on the boundary element method can be combined with those based on the finite element method. For the Electromechanics, Boundary Elements interface, the Solid Mechanics interface is based on finite elements whereas the Electrostatics interface is based on boundary elements. The most important benefits with the boundary element method for electrostatics is that there is no need for a volume mesh in the in-between and surrounding air and there is no need to add infinite elements for the surrounding unbounded domain.